Furukawa America offers a full line of ultra-violet (UV) tape for wafer protection during backgrinding, etching, dicing and BGA/CSP package dicing.

Often called backgrind tape or dicing tape, The Furukawa Electric Co. manufactures our UV tape in its ISO 9001 and ISO 14001 certified production facilities.

Using innovative and proprietary design, materials and processes, Furukawa’s UV tape provides excellent adhesion and removal, surface protection, shock absorption, acid resistance, and wash-free, residue-free performance.

Our superior tape performance translates into higher quality products and lower production costs for you.

FC Series 

FC Series - UV Tape for BGA/CSP Packaging 

 

 

SP Series 

SP Series - UV/Backgrind Tape for Wafer Backgrinding & Etching 

 

UC Series 

UC Series - UV/Dicing Tape for Wafer Dicing